Specialized wire and die bonding solutions
Wire bonding versatility, precision & control
Ball, wedge, bump/stud and peg bonders for any application
Whatever the technique, leading companies look to HYBOND for a full selection of wire bonders and performance features. From precision manual or motorized operation to programmable settings and Soft-Touch™ technology, you can configure performance options to optimize a wide range of bonding processes.
Model 626 Multipurpose Digital Thermosonic Bonder
All-in-one versatility to handle ball, wedge, bump/stud & peg applications for wire and ribbon. Designed for deep-access & long-reach control and precision.
Model 676 Digital Thermosonic Wedge Bonder
Ideal for applications requiring deep access and long-reach for bonding at demanding heights and to sensitive devices with wire or ribbon.
Model 522ABall Bonder
Model 522A, the proven standard for ease of operation and maintenance with HYBOND Soft-Touch technology for bonding sensitive materials.
Model 522A-40 Deep-Access Ball Bonder
522A-40 performance features with added deep-access, long-reach capabilities and a larger work platform.
Model 572AWedge Bonder
Model 572A is a manual deep access thermosonic wedge bonder for use with gold or aluminum wire or ribbon.
Model 572A-40 Deep-Access Wedge Bonder
Model 572A-40 is a deep-access, long-reach thermosonic wedge bonder for use with gold wire and gold or aluminum wire or ribbon.