Specialized wire bonding and die bonding solutions

Model UDB-206B Manual Eutectic Die Bonder

Proven reliability for low to medium volume production

Precise adjustment over ultrasonic scrub energy, force and time.

The EDB-206B is a manual eutectic die bonder using heat and vibration at an ultrasonic frequency to bond devices with consistent wetting without damaging die. HYBOND Soft-Touch™ bonding technology provides added control to reduce the risk of damage to delicate components.

  • HYBOND Soft-Touch™ bonding technology for improved yields
  • Variable height bonding
  • Adjustable scrub time and amplitude
  • Programmable bond schedules

Convenient setup, control and bond repeatability

Standard UDB-206B features include built-in independent work stage and collet temperature controllers. A 62.5KHz ultrasonic scrub system enables digital parameter adjustment in actual units. Bond head vertical movement can be controlled in fast or slow speeds in manual mode.

Hybond's Work Stage WST-15A-RMN

The UDB-206B can handle flip chip bonding with the WST-15A-RMN-FC work stage.

Model UDB-206B Eutectic Die Bonder Features

  • HYBOND Soft-Touch™ bonding technology for improved yields
  • Servo-motorized vertical (Z-axis) control
  • 1.10” (28mm) vertical travel range
  • Variable height bonding within travel range
  • Search height adjustable in 0.001” increments
  • 62.5KHz ultrasonic scrub system
  • Digital parameter adjustment in actual units (watts, milliseconds and grams)
  • Storage for up to ten bond schedules in non-volatile memory
  • Built-in temperature controllers for work stage and collet heat
  • Independent preform and die cycles
  • Dual foot switch control for bond head vertical (up and down) movement
  • Bond head vertical movement can be controlled in fast or slow speed on manual mode
  • Level sensor stops Z-axis movement at contact with bond surface and activates bond cycle
  • Deep access capable (when using long collet)
  • Single axis (Y direction – front to back) scrub
  • Collet heat independent from work stage heat
  • 120VAC std. input power (240VAC with OP-12)
  • Flip chip capable when ordered with WST-15A-RMN-FC work stage.

Model UDB-206B Eutectic Die Bonder Specifications

  • Scrub System: Ultrasonic, 62.5KHz
  • Scrub Amplitude: 0-3 µm (approx.)
  • Bond (Scrub) Time Range: 10 to 900mS
  • Dwell Time (before scrubbing): 0 to 9.9 seconds
  • Bond Force Range: 12 to 300g
  • Temperature Control Range: Stage: Ambient to 500° C, Collet: Ambient to 250° C
  • Bondable Die Size Range: 4 x 4mil up to 100 x 100mil (100 x 100µm to 2,5 x 2,5mm)
  • Placement Accuracy: ± 1 mil (25,4 µm) standard. Higher accuracy when adding other options.
  • Bondable Preform Alloys: AuSn, AuSi, AuGe, and others
  • Bond Head Movement: Servo-motorized vertical movement only
  • Bond Actuation: By touchdown sensor
  • Z Travel /Vertical Bonding Window: 1.10” (28mm) vertical travel range
  • Placement Table Motion: Manual 4:1 manipulator (8:1 option available)
  • Approximate Units Per Hour (UPH): 150 to 900 (operator dependent)
  • Min. Bench Space Required: Width: 25” (63,5cm) Height: 21in (53,3cm) Depth: 30in
  • Facilities Required (min.): Vacuum: 23” Hg (584mmHg), Inert gas: 60psi (4,2Kg/cm2)
  • Input Power Requirements:120VAC standard or 240VAC (with OP-12)
  • Unit Weight /Shipping Weight: 150 lbs (68 Kg) approximately

Optional Features

  • OP-06A: Nikon SMZ660 Microscope
  • OP-08A: Dual Fiber Optic Illuminator
  • HY-Pulse 900A: Pulsed Heat Stage w/force N2 cooling, heated N2 cover gas package enclosure
  • WST-15A-RMN-FC: Work Stage
  • OP-06S6: Leica S6 Zoom Stereo Microscope
  • OP-08R-LED: White LED Ring Illuminator
  • Color CCTV Systems with or without single reticle (target) generator

Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.

Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.

Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.

Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.

Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.

Let Us Know How We Can Help