Specialized wire bonding and die bonding solutions
Model 616B-005 Thermosonic Peg Bonder
Multi-application peg bonding versatility
Single channel peg bonding flexibility for a range of applications and assemblies.
With its built-in temperature control, the HYBOND Model 616B-005 thermosonic peg bonder is designed for precise attachment of insulated or bare wire/ribbon.
- Single channel peg bonder
- Multi-application flexibility
- Soft-Touch™ bonding for reduced damage
- Programmable bond schedules
Ideal for a wide range of bonding needs.
Model 616B-005 can easily adapt to different bonding applications including hard disk stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding and mesh bonding.
Model 616B-005 Thermosonic Peg Bonder Features
- HYBOND Soft-Touch™ bonding technology for improved yields
- Servo-motor vertical (Z-axis) control
- 0.75” vertical bonding window
- Variable height bonding within 0.75”
- Search height adjustable in 0.001” increments
- Hi/Low Ultrasonic Power (PLL Generator)
- Digital Parameter adjustment in actual units
- Storage for up to 10 bond schedules
- Built-in temperature controller
- Bond counter recorder and reset
- Dual footswitch control for bond head vertical (up and down) movement.
- Bond head vertical movement can be controlled in fast or slow speeds on manual mode.
- Bond level sensor system stops Z-axis movement upon contact with bond surface and activates bond cycle.
- Deep access when using 0.750” tool.
Model 616B-005 Thermosonic Peg Bonder Specifications
- Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
- Ultrasonic Power Range: 0-2 watt on Low setting, 0-4 watts on High setting
- Bond Time Range: 0 - 900 mSec
- Bond Force Range: 12 - 300 grams
- Temperature Control Range: 15 to 250° Centigrade
- Bondable Wire Diameters: 0.7 to 3.0mil (18 to 76um) and ribbon up to 1 x 20mil (25 x 500um)
- Bond Head Movement: True linear vertical motorized movement with fast and slow speeds in manual mode or search height pause in auto mode
- Bond Actuation: Bond height sensor activates bond cycle upon contact with bond surface/overtravel
- X-Y Work Platform Motion: Manual, 4:1 ratio between manipulator and X-Y table
- Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std), order OP-12 for 240VAC 50/60Hz
- Minimum Bench Space Required: 20" x 20" (50,8cm x 50,8cm)
- Unit Weight /Shipping Weight: 45/135 lbs (20,41 / 61,24 Kg). Shipping weight will vary.
- Industry Standards: CE certified
Optional Features
- Leica S9E Zoom Stereo Microscope. (OP-06S9E)
- Nikon SMZ745 Microscope (OP-06B)
- Dual Fiber Optic Illuminator (OP-08A-LED)
- White LED Ring Illuminator (OP-08R1-LED)
- Provisions for 240VAC 50/60 Hz power (OP-12)
- Heated Work Stage, 2.125 in. top (WST-15A)
- Heated Work Stage, 2.125" top with (OP-47) 2 x 2" Waffle Pack/Tray holder (WST-15A-WP)
- Beam Lead Diode Bonding option (OP-47)
- PT-X.X: Peg Tool as ordered per application.
- Beam Lead Diode Bonding Tool (BLD-TxWxL)
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.
Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.
Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.
Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.
Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.