Specialized wire bonding and die bonding solutions

Proven performance for insulated or uninsulated wire/ribbon peg bonding

Versatile ultrasonic and thermosonic bonding options

HYBOND multi-industry expertise drives the design and refinement of a full range of peg and beam lead diode bonding tools and specialized solutions. Whatever the technique, leading companies look to HYBOND for a full selection of wire and die bonder performance features.

Hybond's Model 616B-001 Peg Bonder

HYBOND Model 616B-001 Peg Bonder

Designed for ultrasonic attachment of insulated or uninsulated wire/ribbon for ball coining, flex-on-flex ribbon-taking, pin-tab bonding, and mesh bonding.

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Hybond's Model 616B-001 Peg Bonder

Model 616B-003
Peg Bonder

Digital control of ultrasonic attachment for insulated or uninsulated wire/ribbon, ball coining, flex-on-flex, ribbon-tacking, pin-tab bonding and mesh bonding.

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Hybond's Model 616B-005 Thermosonic Peg Bonder

Model 616B-005
Peg Bonder

Thermosonic attachment of insulated or uninsulated wire/ribbon, ball coining, flex-on-flex, ribbon-tacking, pin-tab bonding, & mesh bonding with temp control.

SEE MORE ABOUT 616B-005