Specialized wire bonding and die bonding solutions
Model 616B-001 Digital Ultrasonic Peg Bonder
Designed for bonding applications without wire feeding
Bonding flexibility for a range of applications in medium to high volume production.
HYBOND Model 616B-001 is designed with the flexibility to take on a variety of bonding tasks including “tacking” tuning ribbons, insulated wire bonding, flex-on-flex bonding, pin tab bonding, mesh bonding and ball coining and more.
- Variable height bonding
- Multi-application flexibility
- Soft-Touch™ bonding for reduced damage
- Programmable bond schedules
Ideal for a wide range of interconnect bonding needs.
Model 616B-001 can easily adapt to different bonding tasks. When equipped with a HYBOND programmable X-Y platform, the 6161B-001 can be transformed into a semi-automatic machine enabling higher volume production.
Model 616B-001 Digital Ultrasonic Peg Bonder Features
- HYBOND Soft-Touch™ bonding technology for improved yields
- Servo-motor vertical (Z-axis) control
- 0.75” vertical bonding window
- Variable height bonding within 0.75”
- Search height adjustable in 0.001” increments
- Hi / Low Ultrasonic Power (PLL Generator)
- Digital Parameter adjustment in actual units
- Storage for up to 10 bond schedules
- Dual bond counters for tool use & total bonds
- Dual footswitch control for vertical movement
- Fast or slow Z-axis movement in manual mode
- Deep access when using 0.75" wedge
- Wiring for 120 VAC 50/60Hz @ 10A Max.
Model 616B-001 Digital Ultrasonic Peg Bonder Specifications
- Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
- Ultrasonic Power Range: 0-2 watt on Low setting, 0-4 watts on High setting
- Bond Time Range: 0 - 900 mSec
- Bond Force Range: 12 - 300 grams
- Bondable Wire Diameters: 0.7 to 3.0mil (18 to 76µm)
- Bond Head Movement: True linear vertical (Z) motorized movement with fast and slow speeds in manual mode or search height pause in auto mode
- Bond Actuation: Bond height sensor activates bond cycle upon contact with bond Surface/overtravel
- X-Y Work Platform Motion: Manual, 4:1 ratio between manipulator and X-Y table
- Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std), order OP-12 for 240 VAC 50/60 Hz
- Minimum Bench Space Required: 20" x 20" (50,8cm x 50,8cm)
- Unit Weight /Shipping Weight: 45 / 135 lbs (20,4 / 61,2 Kg). Shipping weight will vary.
- Industry Standards: CE certified
Optional Features
- Leica S9E Zoom Stereo Microscope (OP-06S9E)
- Nikon SMZ745 Microscope (OP-06B)
- Dual Fiber Optic Illuminator (OP-08A-LED)
- White LED Ring Illuminator (OP-08R1-LED)
- Provisions for 240VAC 50/60 Hz operation (OP-12)
- 4in Work Height for Taller Parts (OP-46)
- Beam Lead Diode Bonding option (OP-47)
- Motorized programmable X-Y work platform. Connects to bonder for automatic bond sequencing, joystick control and user interface (OP-54)
- Work platform with custom fixture (WP-CF)
- Work Stages: Heated & Unheated available
- PT-X.X: Peg Tool as ordered per application
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.
Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.
Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.
Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.
Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.