Specialized wire bonding and die bonding solutions

Model 572A-40 Deep-Access Wedge Bonder

With HYBOND Soft-Touch bonding technology for sensitive materials

Proven performance, reliability and bonding control.

HYBOND Model 572A-40 features include a motorized vertical wire feed and wire/ribbon clamping system for precise wire/ribbon control. Operators can easily adjust tail length in 1 mil increments. HYBOND Soft-Touch™ technology bonds effectively with less trauma to sensitive materials like GaAs and InP.

  • Precise feed system for superior control
  • Intuitive front panel controls
  • Soft-Touch™ bonding for reduced damage
  • Larger workstage and longer access/reach capability

Model 572A performance with added deep-access – long-reach functionality and larger work stage.

Model 572A-40 has an expanded work platform size of 10” X 12”. Ease of operation features include a built-in work stage temperature controller, front panel independent controls for first and second bond, U/S, Time and Force as well as ultrasonic testing.


Model 572A-40 Deep-Access Wedge Bonder Features

  • HYBOND Soft-Touch™ bonding technology for improved yields
  • Independent Z-axis lever for bonding tool control
  • Motorized vertical wire feed
  • 1-1-2, 1-2-2 & 1-2-1 stitch capability
  • 0.5” and 2” spool mounts
  • Loop height control adjustment
  • Front panel wire feed control for manual tail adjustment
  • Swing-away wire clamp assembly
  • Deep vertical access of 0.59" (1,49cm)
  • Long horizontal reach of 6.5 in. (16,5cm)
  • Deep access Wire-In-Tool 90° wire feed
  • Wire and ribbon bonding capability
  • Independent control of 1st & 2nd bond parameters
  • Tail length adjustable
  • Audio and visual bond sequence fault indicators
  • 6” x 8.5” work platform
  • LED display of work stage temperature
  • Infinite angle microscope mounting
  • Front panel ultrasonic test button

Model 572A-40 Deep-Access Wedge Bonder Specifications

  • Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
  • Ultrasonic Power Range: 0-1 watt on Low setting (default), 0-2 watts on High setting
  • Bond Time Range: 10 - 400 mSec
  • Bond Force Range: 15 - 120 grams
  • Temperature Control Range: Ambient to 250° C
  • Bondable Wire Diameters:0.5 to 2.0 mils (12,7 to 50,8 µm)<
  • Bondable Ribbon Dimensions: Up to 1 x 10 mils (25,4 x 254 µm)
  • Bondable Wire /Ribbon Materials: Gold and aluminum, copper, silver, platinum
  • Bond Head Movement: Manual
  • Bond Actuation: Switch at fixed height, actuated by lever
  • Z Axis Travel: 0.5” (12,7mm)/60-100mils (1,52-2,54 mm).
  • X-Y Table Motion/Travel: 4:1, manual manipulator standard/0.9 x 0.9in (23 x 23mm) max Vertical Bonding Window: 60 -100 mils (152-254 µm)
  • Table Motion: 4:1, manual manipulator standard/0.9 x 0.9in (23 x 23mm) max.
  • Input Power Requirements: 110VAC 50/60Hz @ 10A max. 240VAC with OP-12.
  • Minimum Bench Space Required: Width: 25in., Depth: 30in. (63,5x76,2cm).
  • Unit Weight /Shipping Weight: 70 lbs (31,8Kg)/150 lbs. Shipping weight will vary.
  • Vacuum Requirement: Vacuum = 20 inHg minimum.
  • Industry Standards: CE certified

Optional Features

  • Leica S9E Zoom Stereo Microscope (OP-06S9E)
  • Nikon SMZ745 Microscope (OP-06B)
  • Dual Fiber Optic Illuminator (OP-08A-LED)
  • White LED Ring Illuminator (OP-08R1-LED)
  • 240VAC 50/60Hz Input Wiring (OP-12)
  • Motorized de-spooler (OP-17)
  • 8:1 X-Y Manipulator (OP-30A)
  • Tool Heater and Temp. Controller (OP-31)
  • Beam Lead/Die Pick, Place & Bond (OP-47)
  • Heated Transducer for Tool Heat (OP-84)
  • Heated Work Stage, 2.125 in top (WST-15A)
  • Heated Work Stage, 4 x 6 in top (WST-19A)
  • Heated Work Stage, 10 x 6 in top (WST-65)
  • Wire & Wedge Tool as ordered per application
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.

Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.

Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.

Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.

Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.

Let Us Know How We Can Help