Specialized wire bonding and die bonding solutions
522A Thermosonic Ball Bonder
With HYBOND Soft-Touch™ bonding technology for sensitive materials
The industry standard for intuitive operation and precise bonding control.
Model 522A Thermosonic Ball Bonder incorporates HYBOND Soft-Touch™ technology for bonding sensitive materials and minimizing risk of damage to delicate components.
- Precise feed system for superior control
- Intuitive front panel
- Soft-Touch™ bonding for sensitive materials
- Programmable bond schedules
Functionality from the front panel to modular maintenance.
Model 522A sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, cycle time, ultrasonic energy, tail length, EFO power, and stage heat. The manual 4:1 X-Y manipulator stage movement and Z-axis bond motion are conveniently located to reduce operator fatigue.
Modular 522A electronics facilitate quick and cost-effective maintenance.
Model 522A Thermosonic Ball Bonder Features
- HYBOND Soft-Touch™ bonding technology for improved yields
- Independent Z-axis lever for bonding tool control
- Motorized vertical wire feed
- 1-2-2 stitch capability
- 0.5” and 2” spool mounts
- Loop height control adjustment
- Electronic ball size control
- Swing-away wire clamp assembly
- High and Low EFO power
- Independent control of 1st and 2nd bond parameters
- Tail length adjustable
- Audio and visual bond sequence fault indicators
- 6” x 8.5” work platform
- LED display of work stage temperature
- Infinite angle microscope mounting
- Front panel ultrasonic test button
Model 522A Thermosonic Ball Bonder Specifications
- Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
- Ultrasonic Power Range: 0-1 watt on Low setting (default), 0-2 watts on High setting
- Bond Time Range: 10 - 400 mSec
- Bond Force Range: 15 - 150 grams
- Temperature Control Range: Ambient to 250° C
- Bondable Wire Diameters: 0.7 to 2.0 mils (18 to 50,8 µm)
- Bondable Wire Materials: Gold wire
- Bonding Capillary Length: 0.437" (standard), 0.750" with deep-reach option (OP-18)
- Bond Head Movement: Manual
- Bond Actuation: Switch at fixed height, actuated by lever
- Z Axis Travel: 0.5 in (1,20 cm) maximum
- Vertical Bonding Window: 60 -100 mils (152-254 µm) max dist. between 1st & 2nd bond
- Table Motion: 4:1 manual manipulator / 0.9 x 0.9in (22,8 x 22,8mm), Standard.
- Input Power Requirements: 120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
- Minimum Bench Space Required: 20" x 20" (50,8cm x 50,8cm)
- Unit Weight /Shipping Weight: 55 / 135 lbs (24,9 / 61,4 Kg). Shipping weight will vary.
- Vacuum Requirement: Vacuum = 20 inHg minimum.
- Industry Standards: CE certified
Optional Features
- Nikon SMZ745 Stereo Microscope (OP-06B)
- Microscope, Camera, Monitor, etc (CCTV-XX)
- Dual Fiber Optic Illuminator (OP-08A-LED)
- White LED Ring Illuminator (OP-08R1-LED)
- 240VAC 50/60Hz Input Wiring (OP-12)
- Board for Bump Bonding (OP-13)
- Motorized de-spooler (OP-17)
- Deep Access/Wedge Bond Capability (OP-18)
- 8:1 X-Y Manipulator (4:1 Standard) (OP-30)
- Tool Heater and Temp. Controller (OP-31)
- Beam Lead/Die Pick, Place & Bond (OP-47)
- Heated Transducer for Tool Heat (OP-81)
- Heated Work Stage, 2.125in. top (WST-15A)
- Heated Work Stage, 3.3in. top (WST-15B)
- Heated Work Stage, rotating top (WST-15CM)
- Wire & Capillary as ordered per application
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.
Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.
Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.
Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.
Trial samples and Applications Guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.