Specialized wire bonding and die bonding solutions

Model 676 Digital Thermosonic Wire and Ribbon Wedge Bonder

Designed for applications with extreme bonding height differences

Expand your range of wire and ribbon wedge bonding applications.

With its deep access and long-reach design, the HYBOND Model 676 digital thermosonic wire and ribbon wedge bonder is ideal for applications that require bonding at demanding heights between the first and second bond, and bonding wires to sensitive devices such as gallium arsenide FET’s, MMIC’s and LED’s.

  • Precise feed system for superior control
  • Deep-access – long-reach versatility and precision
  • Soft-Touch™ bonding for reduced damage
  • Programmable bond schedules

Superior wire/ribbon sensitivity and control with more wire/ribbon options.

The HYBOND Model 676 has the flexibility to vary the amount of clamp “pull back” required to break the wire at the final bond, allowing the use of softer wires with higher elongation.

Model 676’s motorized wire feed and wire/ribbon clamping system provide precise wire/ribbon control. Operators can easily adjust tail length in 0.001” increments at a touch of a switch with accurate control over the bonding process.

Model 676 Digital Thermosonic Wedge Bonder

Model 676 is designed for wire diameters from 0.5 to 3.0 mil (12 to 76µm) and ribbon up to 1.0 x 12.0 mil (25 x 381µm).

Model 676 Digital Thermosonic Wire and Ribbon Wedge Bonder Features

  • HYBOND Soft Touch™ bonding technology for improved yields
  • Programmable, saveable bond schedules and adaptable reset heights
  • Auto-stitch or manual continuous stitch modes for wedge bonding
  • Touch sensor-controlled bond actuation for variable bonding height
  • Digital temperature controller and high/low power PPL ultrasonic generator
  • Deep vertical access and a wide bonding window for added applications
  • Convenient swing-away wire/ribbon clamp assembly Inertial .5” and 2” spool mounts and motorized feed for superior wire control
  • Motorized wire feed and wire/ribbon clamping for superior control
  • Precise z-axis control
  • Optional programmable motorized X-Y operation
  • Expandable pick, place and bond performance

Model 676 Digital Thermosonic Wire and Ribbon Wedge Bonder Specifications

  • Ultrasonic System: PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
  • Ultrasonic Power Range: 0-0.2 watts on Low setting, 0-2 watts on High setting
  • Bond Time Range: 0 - 900 mSec
  • Bond Force Range: 12 - 250 grams
  • Temperature Control Range: Ambient to 250° C
  • Bondable Wire Diameters: 0.5 to 3.0 mils (12,7 to 76,2 µm)
  • Bondable Ribbon Dimensions: Up to 1 x 20mil (25,4 x 510µm). Up to 1x15mil with ribbon in tool. Ribbon wider than 15mil by Peg Bonding
  • Bondable Wire / Ribbon Materials: Gold, Aluminum, Copper, Silver, Platinum
  • Bond Head Movement/Reach: Motorized (servo). Activated by manipulator-mounted switches or foot switches / Horizontal reach up to 6.5in (165mm)
  • Bond Actuation: By sensor at bond surface contact
  • Z Axis Travel: 0.75 in (1,90 cm)
  • Vertical Bonding Window: 0.74 in (1,88 cm)
  • Table Motion: 4:1, manual
  • Input Power Requirements: 90-260 VAC 50/60 Hz @ 10A max
  • Minimum Bench Space Required: Width: 25in., Depth: 30in. (63,5 x 76,2cm).
  • Unit Weight /Shipping Weight: 70 lbs / 150 lbs (31,8 / 68,2 Kg). Shipping weight will vary.
  • Vacuum Requirement: Vacuum = 20 inHg min. (only for use with work stage if needed).
  • Industry Standards: CE certified

Optional Features

  • Leica S7E Zoom Stereo Microscope (OP-06S7E)
  • Nikon SMZ745 Microscope (OP-06B)
  • Dual Fiber Optic Illuminator (OP-08A-LED)
  • White LED Ring Illuminator (OP-08R1-LED)
  • 8:1 X-Y Manipulator (4:1 Standard) (OP-30A)
  • Tool Heater and Temp. Controller (OP-31)
  • Beam Lead/Die Pick, Place & Bond (OP-47A)
  • Motorized X-Y and Y Step-back (OP-54)
  • Heated Work Stage, 2.125 in. top (WST-15A)
  • Heated Work Stage, 4 x 6 in. top (WST-19A)
  • Heated Work Stage, 10 x 6 in top (WST-65)
  • Wire & Wedge Tool as ordered per application
  • Fiber Optic Illuminator
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.

Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.

Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.

Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.

Trial samples and Applications Guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.

Let Us Know How We Can Help