Specialized wire bonding and die bonding solutions
Model UDB-141 Eutectic Die Bonder
Precise preform and die placement with quick device changeover
Ideal for all eutectic materials in lab or production applications.
Two-camera system increases productivity by 2X or more over competitive models. During die placement, the operator can simultaneously target the next die at pick-up location
- Manual and semi-automatic operation
- Independent head/stage temperature control
- Adjustable scrub time and amplitude
- Dual-screen CCTV visual targeting system
Manual or semi-automatic, single-footswitch operation.
Rugged and ready for continuous or limited production runs and a variety of lab applications, UDB-141 design components easily adapt to accommodate fixture modifications with options for waffle pack/gel pack, loose die pedestal, or die ejector.
The UDB-141 turret head enables separate collets to pick up preforms and die for added versatility.
Model UDB-141 Eutectic Die Bonder Features
- Dual-screen CCTV visual targeting system
- Heated nitrogen cover gas
- Preform pickup cycle
- Manual and semiautomatic operation
- Adjustable scrub time and amplitude
- Dual or single axis scrub capable
- Manual X-Y alignment stage
- Waffle pack/loose die pickup pedestal
- Pitch and roll adjustments for bond head
- Independent head and stage temperature control
- Rugged PLC Control
Model UDB-141 Eutectic Die Bonder Specifications
- Scrub System Dual axis: Motorized
- Scrub Amplitude: 0 - 25 mils (0 - 635µm). Same for X and Y in dual axis
- Bond (Scrub) Time Range: 0 to 15 seconds
- Dwell Time (before scrubbing): 0 to 15 seconds
- Bond Force Range: 15 to 130 grams (standard)
- Temperature Control Range: Stage: Ambient to 150° C, Collet: Ambient to 250° C
- Bondable Die Size Range: 6 x 6 mils (152 x 152 µm) to 750 x 750 mils (1,9 x 1,9 µm)
- Placement Accuracy: ± 1 mil (25,4 µm) standard. Less when adding microscope option.
- Bondable Preform Alloys: AuSn, AuSi, AuGe, and others
- Bond Head Movement: Motorized, rotational, w/ fixed pick-up and placement points
- Bond Actuation: By opto-switch at fixed height. Cycle initiated by footswitch.
- Vertical Bonding Window: 0.5” (1.20 cm) / 0.125 to 0.500” (0,31 to 1,20 cm)
- Table Motion: Manual, with thumbscrew adjustments (standard)
- Approx. Units Per Hour (UPH): 90 - 240 depending on options and settings
- Min. Bench Space Required: 18" W 18" H x 22" Dp (46cm x 46cm x 56cm) (Bonder only)
- Facilities Required (min.): Vacuum: 23” Hg. Inert gas 60psi; Compressed air 60-80psi.
- Input Power Requirements: 240 VAC 50/60 Hz @ 8 amps
- Unit Weight /Shipping Weight: 75/150 lbs (34 / 68 Kg). Shipping weight will vary.
Optional Features
- Die Ejector Systems
- Heated N2 gas package enclosure
- Pulse heat placement stages
- Zoom Stereo Microscope w/ Swivel Base
- Dual fiber-optic illumination system
- Lead frame indexing systems
- Semi-automatic indexing systems
- Remote Pendant Controls
- Variable time -ramped temperature generator
- Laser diode alignment search height pause
- Customization based on specific application
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.
Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.
Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.
Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.
Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.