Specialized wire bonding and die bonding solutions
Model EDB-140B Epoxy Die Bonder
Modular design for added versatility and optimization
Ideal for medium to low-volume epoxy dispensing in lab or production applications.
Standard EDB-140B features include a dual-screen CCTV system for enhanced visibility, package depth sensing for consistent bond line thickness and built-in programmable dispensing control for precise die placement and bonding.
- Manual and semi-automatic operation
- Custom matching die collets
- Programmable dispense controls
- CCTV visual targeting system
Semi-automatic operation with added flexibility.
Modular EDB-140B design components easily adapt to accommodate fixture modifications and bonding optimization. Options for waffle pack/gel pack, loose die pedestal, or die ejector can accommodate a variety of die handling requirements.
For applications requiring extremely low-volume epoxy dispensing, the EDB-140B can be fitted with a HYBOND micro-dispense head.
Model EDB-140B Epoxy Die Bonder Features
- Dual-screen CCTV visual targeting system
- Package depth sensing for consistent and precise bond line thickness
- Built-in programmable dispense control
- Storage for up to 200 dispense programs
- Manual X-Y alignment
- Waffle pack/loose die pickup pedestal
- Pitch & Roll adjustments for bond head
- Custom dispense heads/dispense patterns
- Custom die collets to match customer die
- Manual and semiautomatic operation modes
- Remote control panel for ease of operation
- Footswitch operation allows hands-free pick and place operation
Model EDB-140B Epoxy Die Bonder Specifications
- Dispense System: Programmable pressure, time and suck-back (avoids drip) system.
- Bond Line Accuracy: ±.0.5 mil (±m12,7 lµm)
- Temperature Control Range: Ambient.
- Bondable Die Size Range: 6 x 6 mils (152 x 152 µm) to 750 x 750 mils (1,9 x 1,9 µm)
- Placement Accuracy: ± 1 mil (25,4 µm) standard.
- Higher accuracy when adding other options.
- Dispense Materials: Epoxy, conductive epoxy and silver glass.
- Bond Head Actuation: Motorized, rotational, w/ fixed pick-up and placement points.
- Bond Actuation: By opto-sensor at fixed height.
- Cycle initiated by footswitch.
- Vertical Bonding Window: 0.5” (1.20 cm) / 0.125 to 0.500” (0,31 to 1,20 cm).
- Table Motion: Manual, with thumbscrews standard.
- Input Power Requirements: 120 VAC 50/60 Hz @ 8 amps.
- Min. Bench Space Required: Height/width: 24in. (45cm), Depth: 22in. (56cm), without monitor.
- Facilities Required (min.): Vacuum: 23” Hg (584mmHg). Air: 60psi (4,2Kg/cm3).
- Unit Weight /Shipping Weight: 75lbs (34Kg)/150lbs (68Kg). Shipping weight will vary.
- Approx. Units Per Hour (UPH): 90-240 depending on options, settings and mode of operation.
Optional Features
- Die Ejector Systems
- Color CCTV System
- Zoom Stereo Microscope w/ Swivel Base
- Dual fiber-optic illumination system
- Stir column for silver glass /conductive epoxy
- Micro-Dispensing head
- Lead frame indexing systems
- Semi-automatic indexing systems
- Heater stage and temperature controller
- Customization based on specific application
Leading companies rely on HYBOND for technical assistance and support to help keep bonding operations running smoothly.
Dedicated as-needed Field Service
Our factory-based sales and support personal are trained in bonder maintenance and operation. If further on-site expertise is needed, we can deploy support personal worldwide to assist with anything from calibration and optimization to equipment maintenance.
Responsive troubleshooting and Technical Support
Our knowledgeable team is committed to helping you promptly – and free of charge via phone or e-mail. If the issue requires more hands-on attention, we can arrange an on-site service visit for resolution or repair.
Customized technical Training
Expand your expertise and essential skills through our wire bonding fundamentals course. Offered three times a year, and as part of tailored training for small groups, available on-site, or at our sunny California headquarters.
Trial samples and Applications guidance
Our multi-industry bonding experience can provide valuable insight into your specific application requirements. We can set up a trial bonds and help you determine the ideal wire or die bonder for your needs.