Specialized wire bonding and die bonding solutions
Size and materials flexibility for diverse bonding applications
Proven performance options from conductive epoxy to fluxless solder
HYBOND multi-industry expertise drives the design and refinement of a full range die bonding tools and specialized solutions. Whatever the technique, leading companies look to HYBOND for a full selection of wire and die bonder performance features.
Model EDB-141
Epoxy/Silver
Glass Die Bonder
Semi-automatic with selectable dispense programs and bond line accuracy of 12.7 microns for accurate die placement.
Model EDB-140B Epoxy/Silver Glass Die Bonder
Epoxy, conductive epoxy or silver glass semi-automatic dispensing with bond line accuracy of 12.7 microns.
Model UDB-141
Eutectic
Die Bonder
Semi-automatic with easy pick and place operation and placement accuracy as low as 12.5 microns.
Model UDB-206B
Manual Eutectic
Die Bonder
For low to medium volume and high reliability production with precise control of ultrasonic scrub energy, force and time.
HY-Pulse 900C Fluxless/Eutectic Solder Station
As a stand-alone soldering station or used in conjunction with HYBOND UDB-141 and UDB-206B eutectic die bonders.
COMING SOON! HY-Pulse 2300B Fluxless/Eutectic Solder Station
A stand-alone soldering station or used in conjunction with HYBOND UDB-141 & UDB-206B eutectic die bonders. For larger parts consider the HY-Pulse 900C.