The EDB-141 Epoxy/Silver Glass Die Bonder is a semiautomatic epoxy/silver glass die bonder featuring selectable dispense patterns. It provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. It has a bond line accuracy of 12.7 microns. It can handle die sizes up to 25mm standard, and can store 200 dispense programs .
The UDB-141 Semi-automatic Eutectic Die Bonder has a standard placement accuracy of 25 microns and can be as low as 12.5 microns with minor changes. It features single footswitch operation for pick and place. A turret head allows the machine to pickup preforms and die with separate collets.
Model UDB-206A Manual Eutectic Die Bonder bonds devices using heat and vibration at an ultrasonic frequency. It provides precise control of ultrasonic scrub energy, force, and time (scrub duration) to provide consistant wetting without damaging die. The UDB-206A is ideal for low to medium volume and high reliability production.