At HYBOND, our goal is to provide you with what you need to get the job done.In an effort to benefit our customers with a larger selection of products and services, we establish relationships with other companies who have product lines complementary to our own.
About Palomar Technologies:
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment.
Palomar Assembly Services, located in Carlsbad, CA, is the contract assembly, process development, test and prototyping division of Palomar Technologies. Assembly Services provides process expertise with high-precision die attach, wire bond and component placement services, offering its customers an alternative route to meet complex packaging needs without investing in capital equipment.
FRIENDS OF HYBOND
Manufacturer of wedges, capillaries, and die collets (vacuum pick up tools). When using a HYBOND wedge bonder or 626 in wedge bonding mode, we recommend wedge styles 43, 44, 45, or 46 with 45 degree feed hole and a 3/4 inch length. An example of a wedge for a 1 mil gold wire can be Gaiser part number 4445-1520-3/4-CG-F.
For HYBOND ball bonders, you must check if the machine is a deep-access or standard-access machine. Use a 0.437" length capillary for standard access or a 0.750" length capillary for deep access. Model 522-A is a standard-access machine if it does not have the OP-18 (deep access option). Models 522A-18, 522A-40, and 626 are all deep-access machines. If you are not sure which machine you have, check the rear panel sticker for the complete model number. An example of a capillary for a 1 mil wire on a standard-access ball bonder can be Gaiser part number 1572-15-437GM-20D; for deep-access use 1572-15-750GM-20D.
HYBOND die bonders use a variety of collets that must be matched to the dimensions of the device to be bonded. For example, a UDB-206A manual Eutectic Die Bonder can use part number 3601-750-90 (Die Length x Die Width x Die Thickness). View the Eutectic Die Collet datasheet for general information on that type of collet and the Shank Styles datasheet for more details.
A provider of wire and ribbon for bonding and many other applications. When using gold wire on HYBOND machines, we recommend the use of AB Gold wire which is heat treated 99.99% gold wire. This wire is very durable and robust and can be used for ball bonding as well as wedge bonding yielding very good results. For aluminum wire, use 99% Aluminum, 1% Silicon wire which is specifically designed for ultrasonic wire bonding.