Overview
Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
This unit contains a built-in in temperature controller.
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.
Standard Features
- Hybond Soft Touch energy system
- Motorized Z axis control
- 1.5 inch vertical bonding window
- Variable height bonding within 1.5 inch
- Built-in temperature controller
- Search height adjustable in 0.001 inch increments
- 0-900 mSec bond time
- Wiring for 120 VAC 50/60Hz @ 10A Max.
Optional Features
- Leica Stereo Zoom microscope (OP-06S6T)
- Nikon SMZ660 microscope (OP-06A)
- Dual fiber-optic illuminator (OP-08A)
- 240 VAC 50/60 Hz input wiring (OP-12)
- Bonder capability for vacuum pick & place (OP-47)
- 8:1 X-Y Manipulator (OP-30)
- Pick-up / Bond Tool (BLDBT-X) used with OP-47
- Peg Tool (PT-X.X)
Specifications
» Ultrasonic System:
PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
» Ultrasonic Power Range:
0-2 watt on Low setting, 0-4 watts on High setting
» Bond Time Range:
0 - 900 mSec
» Bond Force Range:
12 - 300 grams (higher force available)
» Bondable Wire Diameters:
0.5 to 2.0 mils (12,5 to 50 µm) insulated ; 0.5 to 2.0 mils (12,5 to 50 µm) bare
» Bondable Ribbon Dimensions:
1 x 20mils (25 x 500µm)
» Bondable Wire /Ribbon Materials:
Gold, gold plated copper, and aluminum
» Bond Head Movement:
True vertical motorized movement
» Bond Actuation:
Sensor at variable height, actuated by pushbutton or footswitch
» Z Axis Travel:
1.5 in (3,81 cm)
» Vertical Bonding Window:
1.4 in. (3,55)
» Table Motion:
4:1, manual
» Input Power Requirements:
120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
» Minimum Bench Space Required:
20" x 20" (50,8cm x 50,8cm)
» Unit Weight /Shipping Weight:
45 / 135 lbs (20,41 / 61,24 Kg). Shipping weight will vary.
» Industry Standards:
CE certified
