Peg Bonders - Model 616B-001

Local Time at Hybond: Monday, 02 October 2023, 7:33 AM

Model 616B-001 Digital Ultrasonic Peg Bonder

Model 616B-001 Digital Ultrasonic Peg Bonder


Model 616B-001 Digital Ultrasonic Peg Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire.

Applications include "tacking" tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding , and ball coining.

When fitted with a WP-280 and OP-75, the 616B-001 becomes a semiautomatic machine for medium to high volume production.

Standard Features

  • Hybond Soft Touch energy system
  • Servo-motor vertical (Z axis) control
  • 0.75 inch vertical bonding window
  • Variable height bonding within 0.75 inch
  • Search height adjustable in 0.001 inch increments
  • Hi / Low Ultrasonic Power (PLL Generator)
  • Digital Parameter adjustment in actual units
  • Storage for up to 10 bond schedules
  • Dual bond counters for tool use & total bonds
  • Dual footswitch control for vertical movement
  • Fast or slow Z-axis movement in manual mode
  • Deep access when using 0.75" wedge
  • Wiring for 120 VAC 50/60Hz @ 10A Max.

Optional Features

  • Leica S7E Zoom Stereo Microscope (OP-06S7E)
  • Nikon SMZ745 Microscope (OP-06B)
  • Dual Fiber Optic Illuminator (OP-08A-LED)
  • White LED Ring Illuminator (OP-08R1-LED)
  • Provisions for 240VAC 50/60 Hz operation (OP-12)
  • 4in Work Height for Taller Parts (OP-46)
  • Beam Lead Diode Bonding option (OP-47)
  • Motorized programmable X-Y work platform. Connects to bonder for automatic bond sequencing, joystick control and user interface (OP-54)
  • Work platform with custom fixture (WP-CF)
  • Work Stages: Heated & Unheated available
  • PT-X.X: Peg Tool as ordered per application


» Ultrasonic System:

PLL self-tuning, 62.5 KHz (±2.5KHz) nominal

» Ultrasonic Power Range:

0-2 watt on Low setting, 0-4 watts on High setting

» Bond Time Range:

0 - 900 mSec

» Bond Force Range:

12 - 300 grams

» Bondable Wire Diameters:

0.7 to 3.0mil (18 to 76µm)

» Bond Head Movement:

True linear vertical (Z) motorized movement with fast and slow speeds in manual mode or search height pause in auto mode

» Bond Actuation:

Bond height sensor activates bond cycle upon contact with bond Surface/overtravel

» X-Y Work Platform Motion:

Manual, 4:1 ratio between manipulator and X-Y table

» Input Power Requirements:

120 VAC 50/60 Hz @ 10A (std), order OP-12 for 240 VAC 50/60 Hz

» Minimum Bench Space Required:

20" x 20" (50,8cm x 50,8cm)

» Unit Weight /Shipping Weight:

45 / 135 lbs (20,4 / 61,2 Kg). Shipping weight will vary.

» Industry Standards:

CE certified